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Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72
Chen, Hongqiang1; Xu, Pengzhuo2; Du WF(杜王芳)3,4; Zhang, Yonghai1; Zhu ZQ(朱志强)3,4; Wei, Jinjia1,5
Source PublicationMICROGRAVITY SCIENCE AND TECHNOLOGY
2022-06-06
Volume34Issue:3Pages:15
ISSN0938-0108
Abstract

The uniformly distributed mini-pin-fins on the copper surface were designed and processed, and the enhanced boiling heat transfer performance on mini-pin-finned copper surfaces in FC-72 was investigated. The smooth copper surface was used as the experimental comparison group. The effect of the copper fin height, spacing, and width on the pool boiling heat transfer performance and the fin efficiency were investigated. At the same liquid subcooling, the critical heat flux and heat transfer coefficient of the uniformly distributed mini-pin-finned copper surface increased with the copper fin height, decreased with the rise of the copper fin spacing and fin width. The fin efficiency increases with the rise of the fin height, spacing, and width. The critical heat flux of the mini-pin-finned copper surface (PF0.3-0.2-2) reached 115.4 W center dot cm(-2) at liquid subcooling of 25 K and increased by about 3.62 times compared with the smooth copper surface, and the heat transfer efficiency of mini-pin-finned copper surface (PF0.5-0.2-2) exceeded 95%.

KeywordPool boiling Heat transfer enhancement Mini-pin-fins Critical heat flux
DOI10.1007/s12217-022-09968-x
Indexed BySCI ; EI
Language英语
WOS IDWOS:000806784800001
WOS KeywordTRANSFER COEFFICIENT ; BUBBLE DYNAMICS ; SILICON CHIPS ; FLUX ; FLOW ; VISUALIZATION ; ROUGHNESS ; COATINGS ; WIRE ; FINS
WOS Research AreaEngineering ; Thermodynamics ; Mechanics
WOS SubjectEngineering, Aerospace ; Thermodynamics ; Mechanics
Funding ProjectNational Natural Science Foundation of China[51976163] ; National Natural Science Foundation of China[U2141218] ; National Natural Science Foundation of China[U1738119] ; Key research and development program in Shaanxi Province of China[2021GXLH-Z-076] ; Second batch of scientific experiment proposals aboard China Space Station[TGMTYY00-JY-53-1.00] ; ESA-CMSA Joint Boiling Project[TGMTYY00-RW-05-1.00]
Funding OrganizationNational Natural Science Foundation of China ; Key research and development program in Shaanxi Province of China ; Second batch of scientific experiment proposals aboard China Space Station ; ESA-CMSA Joint Boiling Project
Classification二类
Ranking3+
ContributorZhang, Yonghai
Citation statistics
Cited Times:6[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/89613
Collection微重力重点实验室
Affiliation1.Xi An Jiao Tong Univ, Sch Chem Engn & Technol, Xian 710049, Shaanxi, Peoples R China;
2.Xian Nav Technol Res Inst, Xian 710068, Shaanxi, Peoples R China;
3.Chinese Acad Sci, Inst Mech, Key Lab Micrograv, Beijing 100190, Peoples R China;
4.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China;
5.Xi An Jiao Tong Univ, Key Lab Multiphase Flow Power Engn, Xian 710049, Peoples R China
Recommended Citation
GB/T 7714
Chen, Hongqiang,Xu, Pengzhuo,Du WF,et al. Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72[J]. MICROGRAVITY SCIENCE AND TECHNOLOGY,2022,34,3,:15.
APA Chen, Hongqiang,Xu, Pengzhuo,Du WF,Zhang, Yonghai,Zhu ZQ,&Wei, Jinjia.(2022).Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72.MICROGRAVITY SCIENCE AND TECHNOLOGY,34(3),15.
MLA Chen, Hongqiang,et al."Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72".MICROGRAVITY SCIENCE AND TECHNOLOGY 34.3(2022):15.
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