Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics

doi:10.1016/j.jmatprotec.2022.117551

IMECH-IR > 非线性力学国家重点实验室

	Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics
	Hu, Zhongwei 1,2; Chen, Yue 1,2; Lai, Zhiyuan 1,2; Yu, Yiqing 2; Xu, Xipeng 1,2; Peng Q(彭庆)4; Zhang, Long 3
通讯作者	Yu, Yiqing(yyqing@hqu.edu.cn)
发表期刊	JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
	2022-06-01
卷号	304 页码:14
ISSN	0924-0136
摘要	Coupling of multiple abrasive grains is crucial for the efficiency in the grinding process and grinder design. Here the coupling effect in a double-grain model in vibration-assisted scratch of single-crystal silicon carbide (SiC) have been investigated using the molecular dynamics simulations for both simultaneous and sequential scratch processes. The coupling between the double abrasive grains affect the scratch force, stress, amorphous layer and surface morphology. The reduction ratios of tangential and normal force and the influenced material volume show that the critical distance for the inhibition of the coupling of vibration-assisted scratch is significantly greater than that in conventional scratch. The change of overlap ratio can reflect the change trend of the scratch force reduction ratio. In the vibration-assisted grinding, the increase of overlap ratio also intensifies the coupling of the abrasive grains, resulting in faster material removal, smaller scratch force and better surface finish. In-sights obtained through the molecular dynamics analysis in this work into the coupling effects of abrasive grains in the vibration-assisted grinding process is believed to be beneficial in the development of grinding wheels and the optimization of machining processes.
关键词	Single-crystal silicon carbide Vibration-assisted scratch Double abrasive grains Molecular dynamics
DOI	10.1016/j.jmatprotec.2022.117551
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000806885500002
关键词[WOS]	MATERIAL REMOVAL MECHANISM ; SILICON-CARBIDE ; CRACK-PROPAGATION ; SUBSURFACE DAMAGE ; GLASS-CERAMICS ; SIMULATION ; INTERFERENCE ; BEHAVIOR ; TESTS ; MODEL
WOS研究方向	Engineering ; Materials Science
WOS类目	Engineering, Industrial ; Engineering, Manufacturing ; Materials Science, Multidisciplinary
资助项目	National Natural Science Foundation of China[52175404] ; National Natural Science Foundation of China[51835004] ; State Key Laboratory of Mechanical System and Vibration, China[MSV202112] ; LiYing Program of Institute of Mechanics, Chinese Academy of Sciences, China[E1Z1011001]
项目资助者	National Natural Science Foundation of China ; State Key Laboratory of Mechanical System and Vibration, China ; LiYing Program of Institute of Mechanics, Chinese Academy of Sciences, China
论文分区	二类
力学所作者排名	3+
RpAuthor	Yu, Yiqing
引用统计	被引频次：18[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/89743
专题	非线性力学国家重点实验室
作者单位	1.Huaqiao Univ, Inst Mfg Engn, Xiamen 361021, Peoples R China; 2.Huaqiao Univ, Inst Mech Engn & Automat, Xiamen 361021, Peoples R China; 3.Shanghai Jiao Tong Univ, State Key Lab Mech Syst & Vibrat, Shanghai 200240, Peoples R China; 4.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
推荐引用方式 GB/T 7714	Hu, Zhongwei,Chen, Yue,Lai, Zhiyuan,et al. Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics[J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2022,304:14.
APA	Hu, Zhongwei.,Chen, Yue.,Lai, Zhiyuan.,Yu, Yiqing.,Xu, Xipeng.,...&Zhang, Long.(2022).Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics.JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,304,14.
MLA	Hu, Zhongwei,et al."Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics".JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 304(2022):14.

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