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Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
Authors:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
View  |  Adobe PDF(991Kb)  |  Favorite  |  View/Download：337/163  |  Submit date：2017/10/27
Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour  
On the spherical nanoindentation creep of metallic glassy thin films at room temperature 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 685, 页码: 294-299
Authors:  Zhang TH(张泰华);  Ye JH;  Feng YH(冯义辉);  Ma Y;  Ma, Y (reprint author), Zhejiang Univ Technol, Coll Mech Engn, Inst Micro Nanomech Testing Technol & Applicat, Hangzhou 310014, Zhejiang, Peoples R China.
View  |  Adobe PDF(726Kb)  |  Favorite  |  View/Download：343/123  |  Submit date：2017/07/24
Nanoindentation  Creep  Metallic Glassy Film  Strain Rate Sensitivity  Shear Transformation Zone