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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
Authors:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na;  Zhang, Yonghai;  Wei, Jinjia;  Zhao JF(赵建福);  Li, Bin
Adobe PDF(3519Kb)  |  Favorite  |  View/Download：113/3  |  Submit date：2023/12/11
Thermal interface material  Thermal conductivity  Copper powder  Diamond particles  Filling rate  
Effect of Substrate Microstructure on Thermocapillary Flow and Heat Transfer of Nanofluid Droplet on Heated Wall 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2021, 卷号: 33, 期号: 3, 页码: 10
Authors:  Jiang, Yanni;  Chi, Faxuan;  Chen QS(陈启生);  Zhou, Xiaoming
Adobe PDF(1467Kb)  |  Favorite  |  View/Download：279/72  |  Submit date：2021/06/15
Droplet  Substrate microstructure  Nanofluid  Thermocapillary convection  Two-phase mixture model  Heat transfer  
Numerical Simulation of Quasi-Static Bubble Formation from a Submerged Orifice by the Axisymmetric VOSET Method 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2019, 卷号: 31, 期号: 3, 页码: 279-292
Authors:  Wang T;  Li HX;  Zhao JF(赵建福);  Guo KK
View  |  Adobe PDF(1591Kb)  |  Favorite  |  View/Download：224/87  |  Submit date：2019/09/09
Axisymmetric VOSET method  Bubble formation  Bubble detachment  Static contact angle  Numerical simulation