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An overview of healthcare monitoring by flexible electronics 期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2018, 卷号: 61, 期号: 9, 页码: Ar-94601
Authors:  Hu JQ(胡剑桥);  Li R;  Liu Y;  Su YW(苏业旺)
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Flexible Electronics  Stretchable Electronics  Signal Monitoring  Human Healthcare  
In-Plane Deformation Mechanics for Highly Stretchable Electronics 期刊论文
ADVANCED MATERIALS, 2017, 卷号: 29, 期号: 8, 页码: UNSP 1604989
Authors:  Su YW(苏业旺);  Ping XC;  Yu KJ;  Lee JW;  Fan JA;  Wang B;  Li M;  Li R;  Harburg DV;  Huang YA;  Yu CJ;  Mao SM;  Shim J;  Yang QL;  Lee PY;  Armonas A;  Choi KJ;  Yang YC;  Paik U;  Chang T;  Dawidczyk TJ;  Huang YG;  Wang SD;  Rogers JA;  Wang, SD (reprint author), Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA.;  Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61820 USA.;  Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61820 USA.
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Peeling Experiments Of Ductile Thin Films Along Ceramic Substrates - Critical Assessment Of Analytical Models 期刊论文
International Journal of Solids and Structures, 2008, 页码: 3779-3792
Authors:  Wei YG(魏悦广);  Zhao HF(赵海峰);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Adobe PDF(867Kb)  |  Favorite  |  View/Download:717/168  |  Submit date:2009/08/03
Peel Experiment  Metal Thin Film  Analytical Model  Interfacial Fracture Energy  Pressure-sensitive Adhesive  Strain Gradient Plasticity  State Crack-growth  Fracture Criterion  Cantilever Beam  Round-robin  Work  Toughness  Strength  Surface  
Inverse Analysis Determining Interfacial Properties Between Metal Film And Ceramic Substrate With An Adhesive Layer 期刊论文
Acta Mechanica Sinica, 2008, 卷号: 24, 期号: 3, 页码: 297-303
Authors:  Zhao HF(赵海峰);  Wei YG(魏悦广);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech LNM, Beijing 100080, Peoples R China.
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Thin Film  Peel Test  Interface Toughness  Cohesive Zonemodel  Inverse Analysis  Peel Test  Cu/cr/polyimide System  Fracture Energy  Thin-films  Strength  Joints  Simulations  Plasticity  Surface  Model  
Determination Ofinterfacial Mechanical Parameters For An Al/Epoxy/Al2O3 System Byusing Peel Test Simulations 期刊论文
Acta Mechanica Solida Sinica, 2008, 页码: 198-206
Authors:  You XM(尤雪梅);  Zhao HF(赵海峰);  Wei YG(魏悦广);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(345Kb)  |  Favorite  |  View/Download:675/142  |  Submit date:2009/08/03
Peel Test  Interface Toughness  Cohesive Zone Model  Energy Release Rate  Ductile Thin-films  Cu/cr/polyimide System  Adhesive Joints  Fracture Energy  Ceramic Substrate  Metal-film  Strength  Layer  Plasticity  Surface