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Source Publication：INTERNATIONAL JOURNAL OF APPLIED MECHANICS
Language：英语
Funding Organization：11572249)
Funding Organization：National Natural Science Foundation of China(51508464
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Cooling and Annealing Effect on Indentation Response of Lead-Free Solder
期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
Authors:
Long X
;
Feng YH(冯义辉)
;
Yao Y
;
Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
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Submit date：2017/10/27
Lead-free Solder
Cooling Condition
Annealing
Mechanical Property
Residual Stress
