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Source Publication：MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Date Issued：2022
Language：英语
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Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire
期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2022, 卷号: 142, 页码: 9
Authors:
Chen Y
;
Hu ZW
;
Yu YQ
;
Lai ZY
;
Zhu JG
;
Xu XP
;
Peng Q(彭庆)
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Submit date：2022/07/18
Sapphire
Ultrasonic vibration-assisted grinding
Surface quality
Grinding characteristics
