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Mechanical Properties and Deformation Mechanisms of Graphene Foams with Bi-Modal Sheet Thickness by Coarse-Grained Molecular Dynamics Simulations 期刊论文
MATERIALS, 2021, 卷号: 14, 期号: 19, 页码: 14
Authors:  Liu, Shenggui;  Lyu, Mindong;  Wang C(王超)
Adobe PDF(7393Kb)  |  Favorite  |  View/Download：248/38  |  Submit date：2021/11/29
graphene foam materials  microstructure  bi-modal sheet thickness  stress-strain curve  coarse-grained molecular dynamics  
Effects of W Alloying on the Lattice Distortion and Wear Behavior of Laser Cladding AlCoCrFeNiWx High-Entropy Alloy Coatings 期刊论文
MATERIALS, 2021, 卷号: 14, 期号: 18, 页码: 12
Authors:  Wu, Tao;  Chen, Yunxiang;  Shi, Shuqin;  Wu, Mengting;  Gui, Wanyuan;  Tan YY(谭园园);  Li, Jiheng;  Wu, Yuan
Adobe PDF(28767Kb)  |  Favorite  |  View/Download：239/34  |  Submit date：2021/11/01
laser cladding  high-entropy alloy  coating  lattice distortion  high temperature wear behavior  
Dynamic Mechanical Properties of Several High-Performance Single Fibers 期刊论文
MATERIALS, 2021, 卷号: 14, 期号: 13, 页码: 11
Authors:  Lei XD(雷旭东);  Xiao KL(肖凯璐);  Wu XQ(吴先前);  Huang CG(黄晨光)
Adobe PDF(4609Kb)  |  Favorite  |  View/Download：362/68  |  Submit date：2021/08/16
single fiber  mini-SHTB  SEM  Weibull distribution  
The Influence of Background Ultrasonic Field on the Strength of Adhesive Zones under Dynamic Impact Loads 期刊论文
MATERIALS, 2021, 卷号: 14, 期号: 12, 页码: 3188
Authors:  Volkov, Grigory;  Logachev, Andrey;  Granichin, Nikolai;  Zhao YP(赵亚溥);  Zhang Y(张吟);  Petrov, Yuri
Adobe PDF(2826Kb)  |  Favorite  |  View/Download：222/75  |  Submit date：2022/10/25
dynamic impact  background ultrasonic field  adhesive joint strength  incubation time criterion  fracture dynamics  
Microstructure Dependence of Effective Thermal Conductivity of EB-PVD TBCs 期刊论文
MATERIALS, 2021, 卷号: 14, 期号: 8, 页码: 17
Authors:  Qiu SY(邱世毅);  Wu CW(吴臣武);  Huang CG(黄晨光);  Ma, Yue;  Guo, Hong-Bo
Adobe PDF(5338Kb)  |  Favorite  |  View/Download：357/106  |  Submit date：2021/06/07
thermal barrier coatings  electron beam physical vapor deposition  thermal conductivity  finite element simulation