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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
Authors:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na;  Zhang, Yonghai;  Wei, Jinjia;  Zhao JF(赵建福);  Li, Bin
Adobe PDF(3519Kb)  |  Favorite  |  View/Download：123/5  |  Submit date：2023/12/11
Thermal interface material  Thermal conductivity  Copper powder  Diamond particles  Filling rate  
Soft Wetting: Droplet Receding Contact Angles on Soft Superhydrophobic Surfaces 期刊论文
LANGMUIR, 2023, 卷号: 39, 期号: 43, 页码: 15401-15408
Authors:  Jiang, Youhua;  Xu, Zhijia;  Li, Bin;  Li, Juan;  Guan DS(关东石)
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