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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
Authors:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na;  Zhang, Yonghai;  Wei, Jinjia;  Zhao JF(赵建福);  Li, Bin
Adobe PDF(3519Kb)  |  Favorite  |  View/Download：121/5  |  Submit date：2023/12/11
Thermal interface material  Thermal conductivity  Copper powder  Diamond particles  Filling rate  
Numerical Simulation of Quasi-Static Bubble Formation from a Submerged Orifice by the Axisymmetric VOSET Method 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2019, 卷号: 31, 期号: 3, 页码: 279-292
Authors:  Wang T;  Li HX;  Zhao JF(赵建福);  Guo KK
View  |  Adobe PDF(1591Kb)  |  Favorite  |  View/Download：230/90  |  Submit date：2019/09/09
Axisymmetric VOSET method  Bubble formation  Bubble detachment  Static contact angle  Numerical simulation