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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
Authors:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na;  Zhang, Yonghai;  Wei, Jinjia;  Zhao JF(赵建福);  Li, Bin
Adobe PDF(3519Kb)  |  Favorite  |  View/Download：128/6  |  Submit date：2023/12/11
Thermal interface material  Thermal conductivity  Copper powder  Diamond particles  Filling rate  
Critical heat flux prediction model of pool boiling heat transfer on the micro-pillar surfaces 期刊论文
CASE STUDIES IN THERMAL ENGINEERING, 2021, 卷号: 28, 页码: 15
Authors:  Zhang, Yonghai;  Ma, Xiang;  Zhu ZQ(朱志强);  Duan, Lian;  Wei, Jinjia
Adobe PDF(4941Kb)  |  Favorite  |  View/Download：290/70  |  Submit date：2022/03/28
Critical heat flux  Prediction model  Pool boiling  Micro-pillar surfaces