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Indexed By:SCI
Source Publication:MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Creator:Keer LM
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Creator:Long X
Creator:冯义辉
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Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
Authors:
Long X
;
Wang SB
;
Feng YH(冯义辉)
;
Yao Y
;
Keer LM
;
Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
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Submit date:2017/10/27
Lead-free Solder
Annealing
Residual Stress
Nanoindentation
Constitutive Behaviour