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Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
Authors:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
View  |  Adobe PDF(991Kb)  |  Favorite  |  View/Download：336/163  |  Submit date：2017/10/27
Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour