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Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate 期刊论文
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2018, 卷号: 85, 期号: 9, 页码: Ar-91004
Authors:  Yin HB;  Chen SH;  Liang LH(梁立红);  Peng ZL(彭志龙);  Wei YG(魏悦广)
View  |  Adobe PDF(4041Kb)  |  Favorite  |  View/Download：357/141  |  Submit date：2018/12/12
film-substrate system  interface behavior  peeling force  cohesive zone model  L-J potential  
Determination Ofinterfacial Mechanical Parameters For An Al/Epoxy/Al2O3 System Byusing Peel Test Simulations 期刊论文
Acta Mechanica Solida Sinica, 2008, 页码: 198-206
Authors:  You XM(尤雪梅);  Zhao HF(赵海峰);  Wei YG(魏悦广);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(345Kb)  |  Favorite  |  View/Download：658/140  |  Submit date：2009/08/03
Peel Test  Interface Toughness  Cohesive Zone Model  Energy Release Rate  Ductile Thin-films  Cu/cr/polyimide System  Adhesive Joints  Fracture Energy  Ceramic Substrate  Metal-film  Strength  Layer  Plasticity  Surface