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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
Authors:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na;  Zhang, Yonghai;  Wei, Jinjia;  Zhao JF(赵建福);  Li, Bin
Adobe PDF(3519Kb)  |  Favorite  |  View/Download：121/5  |  Submit date：2023/12/11
Thermal interface material  Thermal conductivity  Copper powder  Diamond particles  Filling rate  
Lattice Thermal Conductivity of Mg3(Bi,Sb)2 Nanocomposites: A First-Principles Study 期刊论文
NANOMATERIALS, 2023, 卷号: 13, 期号: 22, 页码: 12
Authors:  Peng Q(彭庆);  Yuan XZ(袁晓泽);  Zhao S(赵帅);  Chen, Xiao-Jia
Adobe PDF(4964Kb)  |  Favorite  |  View/Download：86/9  |  Submit date：2024/01/08
Mg-3(BixSb1-x)(2)  lattice thermal conductivity  first-principles calculations  
Experimental and Theoretical Studies of Different Parameters on the Thermal Conductivity of Nanofluids 期刊论文
MICROMACHINES, 2023, 卷号: 14, 期号: 5, 页码: 964
Authors:  Qin J(秦军);  Tao YQ(陶跃群);  Liu QS(刘秋生);  Li ZL(李子龙);  Zhu ZQ(朱志强);  He NF(何乃峰)
Adobe PDF(1829Kb)  |  Favorite  |  View/Download：91/5  |  Submit date：2023/06/15
nanofluid  thermal conductivity  thermal conductivity model  transient plane source method