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Temperature gradient enhances the solidification process and properties of a CoCrFeNi high-entropy alloy: Atomic insights from molecular dynamics simulations 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2024, 卷号: 231, 页码: 12
Authors:  Xie, Lu;  Wu, Guangda;  Liaw, Peter K.;  Wang, Wenrui;  Li, Dongyue;  Peng Q(彭庆);  Zhang, Jie;  Zhang, Yong
Favorite  |  View/Download：133/0  |  Submit date：2023/12/11
High-entropy alloy  Temperature gradient  Stress distribution  Cooling rate  
A nanotwin-based analytical model to predict dynamics in cryogenic orthogonal machining copper 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2020, 卷号: 111, 期号: 11-12, 页码: 3189-3205
Authors:  Liu Y(刘垚);  Cai SL(蔡松林);  Chen Y(陈艳);  Su MY(苏明耀);  Dai LH(戴兰宏)
Adobe PDF(11473Kb)  |  Favorite  |  View/Download：500/69  |  Submit date：2020/12/28
Machining  METAL-CUTTING PROCESS  Orthogonal cutting model  SURFACE INTEGRITY  Cryogenic cooling  FLOW-STRESS  Hopf bifurcation  RATE SENSITIVITY  Nanotwin  INCONEL 718  GRAIN-SIZE  STRENGTH  MICROSTRUCTURE  DEFORMATION  SPEED