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Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint
期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
Authors:
Zhang, Sinan
;
Wang Z(王振)
;
Wang, Jie
;
Duan GH(段桂花)
;
Li, Haixia
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Submit date：2022/08/22
Cu/SAC305/Cu solder joints
in situ tensile test
fracture analysis
X-ray mu-CT
FE simulation
