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Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
Authors:  Zhang, Sinan;  Wang Z(王振);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
Adobe PDF(8729Kb)  |  Favorite  |  View/Download：242/91  |  Submit date：2022/08/22
Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation  
Tensile Behaviors and Strain Hardening Mechanisms in a High-Mn Steel with Heterogeneous Microstructure 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 10, 页码: 13
Authors:  Zhang SD(张胜德);  Liu YK(刘琰珂);  Wang J(王建);  Tan S(覃双);  Wu XL(武晓雷);  Yuan FP(袁福平)
Adobe PDF(6018Kb)  |  Favorite  |  View/Download：265/103  |  Submit date：2022/07/18
microband-induced plasticity  heterogeneous structures  steels  strain hardening  strengthening  ductility