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In-Plane Deformation Mechanics for Highly Stretchable Electronics 期刊论文
ADVANCED MATERIALS, 2017, 卷号: 29, 期号: 8, 页码: UNSP 1604989
Authors:  Su YW(苏业旺);  Ping XC;  Yu KJ;  Lee JW;  Fan JA;  Wang B;  Li M;  Li R;  Harburg DV;  Huang YA;  Yu CJ;  Mao SM;  Shim J;  Yang QL;  Lee PY;  Armonas A;  Choi KJ;  Yang YC;  Paik U;  Chang T;  Dawidczyk TJ;  Huang YG;  Wang SD;  Rogers JA;  Wang, SD (reprint author), Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA.;  Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61820 USA.;  Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61820 USA.
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