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Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9
Authors:  Long X;  Hu B;  Feng YH(冯义辉);  Chang C;  Li MY
View  |  Adobe PDF(3448Kb)  |  Favorite  |  View/Download：335/169  |  Submit date：2020/03/11
Silver nanoparticles  Silver microparticles  Nanoindentation  Microstructure  Constitutive behaviour  
Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder 期刊论文
MICROMACHINES, 2018, 卷号: 9, 期号: 11, 页码: Ar-608
Authors:  Long X;  Zhang XD;  Tang WB;  Wang SB;  Feng YH(冯义辉);  Chang C
View  |  Adobe PDF(6447Kb)  |  Favorite  |  View/Download：327/123  |  Submit date：2018/12/12
nanoindentation  constitutive model  rate factor  dimensionless analysis  solder  
Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 140, 页码: 60-67
Authors:  Long X;  Tang WB;  Feng YH(冯义辉);  Chang C;  Keer LM;  Yao Y
View  |  Adobe PDF(3712Kb)  |  Favorite  |  View/Download：324/149  |  Submit date：2018/07/17
Silver Nanoparticles  Strain Rate Sensitivity  Nanoindentation  Strain Rate Sensitivity  Creep Strain Rate  Stress Exponent  
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
Authors:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
View  |  Adobe PDF(991Kb)  |  Favorite  |  View/Download：348/169  |  Submit date：2017/10/27
Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour  
Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
Authors:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
View  |  Adobe PDF(399Kb)  |  Favorite  |  View/Download：345/165  |  Submit date：2017/10/27
Lead-free Solder  Cooling Condition  Annealing  Mechanical Property  Residual Stress