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Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics 期刊论文
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2017, 卷号: 110, 页码: 305-314
作者:  Li S;  Liu XL;  Li R;  Su YW(苏业旺);  Su, YW (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.;  Li, R;  Su, YW (reprint author), Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China.;  Su, YW (reprint author), Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China.
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Shear Deformation  Adhesive Layer  Laminated Structure  Flexible Electronics