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Enhanced tensile ductility and strength of electrodeposited ultrafine-grained nickel with a desired bimodal microstructure 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 701, 页码: 196-202
作者:  Zhang, Qian;  Liu, Ying;  Liu, Yongsheng;  Ren, Yanhong;  Wu, Yanxia;  Gao, Zhipeng;  Wu XL(武晓雷);  Han, Peide;  Liu, Y (reprint author), Taiyuan Univ Technol, Coll Mat Sci & Engn, Taiyuan 030024, Peoples R China.
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Electrodeposition  Nickel  Bimodal Microstructure  Twins  Spatial Distribution  Mechanical Property  
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
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Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour  
On the spherical nanoindentation creep of metallic glassy thin films at room temperature 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 685, 页码: 294-299
作者:  Zhang TH(张泰华);  Ye JH;  Feng YH(冯义辉);  Ma Y;  Ma, Y (reprint author), Zhejiang Univ Technol, Coll Mech Engn, Inst Micro Nanomech Testing Technol & Applicat, Hangzhou 310014, Zhejiang, Peoples R China.
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Nanoindentation  Creep  Metallic Glassy Film  Strain Rate Sensitivity  Shear Transformation Zone