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Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method 期刊论文
力学学报, 2002, 卷号: 34, 期号: 3, 页码: 535-540
Authors:  Wang HY(汪海英);  Bai YL(白以龙);  Wang JJ(王建军)
Adobe PDF(2660Kb)  |  Favorite  |  View/Download:447/87  |  Submit date:2007/06/15
中科院力学所1998年科研工作回顾 期刊论文
力学进展, 1999, 卷号: 29, 期号: 2, 页码: 276-277
Authors:  吕明身
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