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Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al 期刊论文
Acta Materialia, 2007, 卷号: 55, 期号: 9, 页码: 3169-3175
作者:  Chen SD;  Ke FJ(柯孚久);  Zhou M;  Bai YL(白以龙);  Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
Adobe PDF(3490Kb)  |  收藏  |  浏览/下载：970/391  |  提交时间：2009/08/03
Diffusion Bonding  Molecular Dynamics  Temperature Effect  Tensile Strength  Molecular-dynamics Simulation  Embedded-atom-method  Theoretical-model  Interface  Alloys  Copper  Metals  Ni  
Microstructural evolution and formation of nanocrystalline intermetallic compound during surface mechanical attrition treatment of cobalt 期刊论文
Acta Materialia, 2007, 卷号: 55, 期号: 17, 页码: 5768-5779
作者:  Wu XL(武晓雷);  Tao NR;  Wei QM;  Jiang P;  Lu J;  Lu K;  Wu, XL (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China.
Adobe PDF(1594Kb)  |  收藏  |  浏览/下载：678/163  |  提交时间：2009/08/03
Nanocrystalline Materials  Diffusion  Intermetallics  Surface Mechanical Attrition  Severe Plastic-deformation  High-pressure Torsion  Triple Junctions  Nanostructured Materials  Magnetic-properties  Enhanced Diffusion  Self-diffusion  Pipe Diffusion  Alloys  Dislocations