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Numerical simulation of thermal response behavior of floating-roof tanks exposed to pool fire 期刊论文
APPLIED THERMAL ENGINEERING, 2020, 卷号: 179, 页码: 14
作者:  Wang XZ(王秀珍);  Zhou KB;  Mebarki A;  Jiang JC
Adobe PDF(4052Kb)  |  收藏  |  浏览/下载：291/131  |  提交时间：2020/10/23
Thermal response  Radiant heat  Pool fire  Storage tank  Numerical simulation  
Numerical investigation on bubble dynamics during pool nucleate boiling in presence of a non-uniform electric field by LBM 期刊论文
APPLIED THERMAL ENGINEERING, 2019, 卷号: 155, 页码: 637-649
作者:  Feng Y;  Li HX;  Guo KK;  Lei XL;  Zhao JF(赵建福)
浏览  |  Adobe PDF(3461Kb)  |  收藏  |  浏览/下载：305/128  |  提交时间：2019/09/09
Lattice Boltzmann method  Electrohydrodynamics  Bubble departure diameter  Bubble release frequency  
Influences of wake-effects on bubble dynamics by utilizing micro-pin-finned surfaces under microgravity 期刊论文
APPLIED THERMAL ENGINEERING, 2017, 卷号: 113, 页码: 1332-1344
作者:  Qi BJ;  Wei JJ;  Wang XL;  Zhao JF(赵建福);  Wei, JJ (reprint author), Xi An Jiao Tong Univ, Sch Chem Engn & Technol, Xian 710049, Peoples R China.
浏览  |  Adobe PDF(3276Kb)  |  收藏  |  浏览/下载：490/121  |  提交时间：2017/04/26
Influence of heater thermal capacity on bubble dynamics and heat transfer in nucleate pool boiling 期刊论文
APPLIED THERMAL ENGINEERING, 2015, 卷号: 88, 期号: SI, 页码: 118-126
作者:  Zhang L(张良);  Li ZD(李震东);  Li K(李凯);  Li HX;  Zhao JF(赵建福);  Zhao, JF (reprint author), Chinese Acad Sci, Inst Mech, Key Lab Micrograv, Nat Micrograv Lab, Beijing 100190, Peoples R China.
浏览  |  Adobe PDF(3154Kb)  |  收藏  |  浏览/下载：448/118  |  提交时间：2015/11/09
Single Bubble Pool Boiling  Transient Thermal Response Of Solid Wall  Bubble Dynamics  Heat Transfer  
Bubble dynamics in nucleate pool boiling on micro-pin-finned surfaces in microgravity 期刊论文
APPLIED THERMAL ENGINEERING, 2014, 卷号: 70, 期号: 1, 页码: 172-182
作者:  Zhang YH;  Wei JJ;  Xue YF;  Kong X;  Zhao JF(赵建福);  Wei, JJ (reprint author), Xi An Jiao Tong Univ, State Key Lab Multiphase Flow Power Engn, Xian 710049, Peoples R China.
浏览  |  Adobe PDF(2756Kb)  |  收藏  |  浏览/下载：827/273  |  提交时间：2014/11/03
Heat-transfer  Silicon Chips  Fc-72  Departure  Fins