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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
作者:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na;  Zhang, Yonghai;  Wei, Jinjia;  Zhao JF(赵建福);  Li, Bin
Adobe PDF(3519Kb)  |  收藏  |  浏览/下载：104/2  |  提交时间：2023/12/11
Thermal interface material  Thermal conductivity  Copper powder  Diamond particles  Filling rate  
Experimental Study of Upward Flame Spread over Discrete Weathered Wood Chips 期刊论文
INTERNATIONAL JOURNAL OF ARCHITECTURAL HERITAGE, 2021, 页码: 12
作者:  Zhou Biao;  Wang Kai;  Liuchen Yanyi;  Li Yuhang;  Sun Xukun;  Zhu F(朱凤);  Ke Wei;  Wang Xuan;  Qiu Bo;  Han Yajun
Adobe PDF(3475Kb)  |  收藏  |  浏览/下载：224/76  |  提交时间：2021/05/17
Discrete fuels  flame spread rate  MLR  weathered wood  wooden culture heritage