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The influence of combined gradient structure with residual stress on crack-growth behavior in medium carbon steel 期刊论文
ENGINEERING FRACTURE MECHANICS, 2019, 卷号: 209, 页码: 369-381
作者:  Wang Y(王瑶);  Yuan LC;  Zhang SJ(张诗嘉);  Sun CQ(孙成奇);  Wang WJ;  Yang GX;  Li Q;  Wei YJ(魏宇杰)
浏览  |  Adobe PDF(2613Kb)  |  收藏  |  浏览/下载：383/152  |  提交时间：2019/04/11
Gradient material  Residual stress  Fatigue crack  Cyclic J-integral  Crack- growth rate  
Metal ductility evaluation by flattening test: The geometry dependence 期刊论文
INTERNATIONAL JOURNAL OF PRESSURE VESSELS AND PIPING, 2019, 卷号: 170, 页码: 40-48
作者:  Wang Y;  Yang GX;  Lei XQ(雷现奇);  Li Q;  Rong LJ;  Hu XF;  Wei YJ(魏宇杰)
浏览  |  Adobe PDF(2257Kb)  |  收藏  |  浏览/下载：446/117  |  提交时间：2019/04/11
Flattening test  Plastic deformability  Gerson-Tvergaard-Needleman model  Failure  Finite element analysis  
Stress evolution in elastic-plastic electrodes during electrochemical processes: A numerical method and its applications 期刊论文
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2018, 卷号: 116, 页码: 403-415
作者:  Wen JC(温济慈);  Wei YJ(魏宇杰);  Cheng YT(郑仰泽)
Adobe PDF(2242Kb)  |  收藏  |  浏览/下载：543/142  |  提交时间：2018/10/30
Battery mechanics  Electrochemical-mechanical coupling  Interfacial delamination  In situ stress measurement  Finite element method  
Electronic band structure of carbon honeycombs 期刊论文
MATERIALS TODAY PHYSICS, 2018, 卷号: 5, 页码: 72-77
作者:  Pang ZQ(庞振乾);  Gu, Xiaokun;  Wei YJ(魏宇杰);  Yang, Ronggui
Adobe PDF(2637Kb)  |  收藏  |  浏览/下载：84/33  |  提交时间：2022/10/25
Ultralight weight  sp(3) hybridization  Semiconductor  Band gap  Boron-honeycomb  Phonon dispersion  
Bottom-up Design of Three-Dimensional Carbon-Honeycomb with Superb Specific Strength and High Thermal Conductivity 期刊论文
NANO LETTERS, 2017, 卷号: 17, 期号: 1, 页码: 179-185
作者:  Pang ZQ;  Gu XK;  Wei YJ(魏宇杰);  Yang RG;  Dresselhaue MS;  Wei, YJ (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100190, Peoples R China.
浏览  |  Adobe PDF(3270Kb)  |  收藏  |  浏览/下载：527/178  |  提交时间：2017/02/24
Carbon Honeycomb  Specific Strength  Thermal Conductivity  Sp(3)-bonding