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Atomistic Insights on Surface Quality Control via Annealing Process in AlGaN Thin Film Growth 期刊论文
NANOMATERIALS, 2023, 卷号: 13, 期号: 8, 页码: 1382
作者:  Peng Q(彭庆);  Ma ZW(马知未);  Cai, Shixian;  Zhao S(赵帅);  Chen, Xiaojia;  Cao, Qiang
Adobe PDF(2490Kb)  |  收藏  |  浏览/下载：38/0  |  提交时间：2023/06/15
AlGaN thin film  molecular dynamics simulations  laser annealing  atomistic structure  
Investigation on the Fatigue Crack Propagation of Medium-Entropy Alloys with Heterogeneous Microstructures 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 17, 页码: 14
作者:  Liu Y(刘洋);  Jiang P(姜萍);  Duan GH(段桂花);  Wang J(王晶);  Zhou LL(周玲玲);  Xie JJ(谢季佳)
Adobe PDF(28413Kb)  |  收藏  |  浏览/下载：147/21  |  提交时间：2022/09/29
heterogeneous microstructure  MEA  recrystallization annealing  fatigue crack propagation threshold  fatigue crack growth path  cyclic plastic zone  
Microstructure evolution in Si+ ion irradiated and annealed Ti3SiC2 MAX phase 期刊论文
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2022, 页码: 8
作者:  Ye, Chao;  Chang, Qing;  Lei, Penghui;  Dong, Wenhui;  Peng Q(彭庆)
Adobe PDF(2055Kb)  |  收藏  |  浏览/下载：171/43  |  提交时间：2022/06/11
annealing  dislocation networks  ion irradiation  ripplocations  Ti3SiC2  
Molecular dynamics simulation of helium ion implantation into silicon and its migration 期刊论文
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2019, 卷号: 456, 页码: 53-59
作者:  Liu L;  Xu ZW;  Li RR;  Zhu R;  Xu J;  Zhao JL;  Wang C(王超);  Nordlund K;  Fu X;  Fang FZ
Adobe PDF(8550Kb)  |  收藏  |  浏览/下载：221/86  |  提交时间：2019/10/14
Molecular dynamics simulation  Ion implantation  Helium  Si  Annealing  
One-step annealing optimizes strength-ductility tradeoff in pearlitic steel wires 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 757, 页码: 1-13
作者:  Xiang L(向亮);  Liang LW(梁伦伟);  Wang YJ(王云江);  Chen Y(陈艳);  Wang HY(汪海英);  Dai LH(戴兰宏)
Adobe PDF(3415Kb)  |  收藏  |  浏览/下载：459/156  |  提交时间：2019/09/09
Pearlitic steel wire  Carbon state  Annealing  Strength and ductility  Atomistic simulations  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：309/178  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
Microstructure and Mechanical Properties of a Cold-Rolled Ultrafine-Grained Dual-Phase Steel 期刊论文
MATERIALS, 2018, 卷号: 11, 期号: 8, 页码: 1399
作者:  Pan ZY;  Gao B;  Lai QQ;  Chen XF(陈雪飞);  Cao Y;  Liu MP;  Zhou H
Adobe PDF(31958Kb)  |  收藏  |  浏览/下载：363/35  |  提交时间：2018/10/30
dual phase steel  cold-rolling  intercritical annealing  microstructure refinement  
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
Adobe PDF(991Kb)  |  收藏  |  浏览/下载：317/154  |  提交时间：2017/10/27
Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour  
Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
Adobe PDF(399Kb)  |  收藏  |  浏览/下载：309/152  |  提交时间：2017/10/27
Lead-free Solder  Cooling Condition  Annealing  Mechanical Property  Residual Stress