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Experimental Investigation of Dynamic Fracture Behaviors of Polymethyl Methacrylate 会议论文
23rd World Forum on Advanced Polymeric Materials (POLYCHAR), Univ Nebraska Lincoln, Lincoln, NE, MAY 11-15, 2015
作者:  Gao GY;  Zhou J;  Li Z;  Li, Z (reprint author), Peking Univ, State Key Lab Turbulence & Complex Syst, Beijing 100871, Peoples R China.;  Li, Z (reprint author), Peking Univ, Coll Engn, Beijing 100871, Peoples R China.
浏览  |  Adobe PDF(2033Kb)  |  收藏  |  浏览/下载：248/104  |  提交时间：2017/05/12
Crack Interaction  Fracture  Optical Method Of Caustics  Semi-circular Bending  Toughness  Stress Intensity Factor  Semicircular Bend Technique  Crack-propagation  Brittle-fracture  Caustic Analysis  Specimen  Pmma  Parallel  Field  Rock  
Stiction of flexural MEMS structures 会议论文
3rd International Conference on Digital Manufacturing and Automation, ICDMA 2012, Guangxi, China, AUG 01-02, 2012
作者:  Liu Y;  Zhang Y(张吟)
Adobe PDF(307Kb)  |  收藏  |  浏览/下载：703/226  |  提交时间：2013/02/26
Adhesion  Boundary Conditions  Composite Micromechanics  Manufacture  Stiction  Variational Techniques  Beam Bending  Beam Deflection  Beam Length  Constraint Conditions  Contact Areas  Contact Separation  Elastic Energy  External Loads  Matching Condition  Mems-structure  Micro-cantilevers  Microcantilever Beams  Principle Of Virtual Work  Rayleigh-ritz Methods  s Shape  S-shaped  Significant Impacts  Variational Methods  
The influences of residual surface stress on the thermo-elastic bending of simply supported nanoplates 会议论文
3rd International Conference on Heterogeneous Materials Mechanics, ICHMM 2011, Shanghai, China, MAY 22-26, 2011
作者:  Wang ZQ(王志乔);  Zhao YP(赵亚溥);  Wang ZQ
Adobe PDF(141Kb)  |  收藏  |  浏览/下载：619/122  |  提交时间：2013/02/26
Elasticity  Interfacial Energy  Surface Properties  Classical Plate Theory  Mechanical Behavior  Nano Scale  Nanoplates  Simply Supported  Surface Elasticities  Surface Residual Stress  Surface Stress  Thermal Bending  
Extracting nanowire mechanical properties from three-point bendig test 会议论文
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010, Las Vegas, NV, United states, June 2, 2010 - June 5, 2010
作者:  Liu Y;  Zhang Y(张吟);  Liu, Y.
收藏  |  浏览/下载：127/0  |  提交时间：2017/06/20
Changing Trends  Elastic Medium  Experimental Data  Nanowire Materials  Receding Contact  Significant Impacts  Three-point Bending Test  Young's Modulus