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A micromechanical model for deformation behavior of nanocrystalline copper 会议论文
2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, China, NOV 06-08, 2010
作者:  Lan JX(兰姣霞);  Wu YZ(吴永中);  Hong YS(洪友士);  Lan JX
浏览  |  Adobe PDF(353Kb)  |  收藏  |  浏览/下载：549/132  |  提交时间：2013/02/26
Algorithms  Copper  Deformation  Grain Boundaries  Grain Size And Shape  Materials  Micromechanics  Molecular Dynamics  Strain Energy  Deformation Behavior  Deformation Mechanism  Developed Model  Experimental Values  Grain Shapes  Grain Size  Internal Variable Theory  Iteration Algorithms  Micromechanical Model  Molecular Dynamics Simulations  Nanocrystalline Copper  Nanocrystallines  Pure Copper  Statistical Distribution  Stress Strain Relation  Uniaxial Tensions  
Microstructure and mechanical properties at different length scales and strain rates of nanocrystalline tantalum produced by high-pressure torsion 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 6, 页码: 2423-2436
作者:  Wei Q;  Pan ZL;  Wu XL(武晓雷);  Schuster BE;  Kecskes LJ;  Valiev RZ;  Wei, Q (reprint author), Univ N Carolina, Dept Mech Engn & Engn Sci, 9201 Univ City Blvd, Charlotte, NC 28223 USA
Adobe PDF(2092Kb)  |  收藏  |  浏览/下载：904/342  |  提交时间：2012/04/01
Nanocrystalline  Tantalum  Microstructure  Mechanical Properties  Adiabatic Shear Band  Centered-cubic Metals  Severe Plastic-deformation  Nonequilibrium Grain-boundaries  Hall-petch Behavior  Tensile Behavior  Rate Sensitivity  Ultrafine Grain  Shear Bands  Uniaxial Compression  Screw Dislocations