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Enhanced tensile ductility and strength of electrodeposited ultrafine-grained nickel with a desired bimodal microstructure 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 701, 页码: 196-202
作者:  Zhang, Qian;  Liu, Ying;  Liu, Yongsheng;  Ren, Yanhong;  Wu, Yanxia;  Gao, Zhipeng;  Wu XL(武晓雷);  Han, Peide;  Liu, Y (reprint author), Taiyuan Univ Technol, Coll Mat Sci & Engn, Taiyuan 030024, Peoples R China.
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Electrodeposition  Nickel  Bimodal Microstructure  Twins  Spatial Distribution  Mechanical Property  
Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
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Lead-free Solder  Cooling Condition  Annealing  Mechanical Property  Residual Stress