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A micromechanical model for deformation behavior of nanocrystalline copper 会议论文
2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, China, NOV 06-08, 2010
作者:  Lan JX(兰姣霞);  Wu YZ(吴永中);  Hong YS(洪友士);  Lan JX
浏览  |  Adobe PDF(353Kb)  |  收藏  |  浏览/下载：547/132  |  提交时间：2013/02/26
Algorithms  Copper  Deformation  Grain Boundaries  Grain Size And Shape  Materials  Micromechanics  Molecular Dynamics  Strain Energy  Deformation Behavior  Deformation Mechanism  Developed Model  Experimental Values  Grain Shapes  Grain Size  Internal Variable Theory  Iteration Algorithms  Micromechanical Model  Molecular Dynamics Simulations  Nanocrystalline Copper  Nanocrystallines  Pure Copper  Statistical Distribution  Stress Strain Relation  Uniaxial Tensions  
Molecular dynamics studies of brittle fracture of SiO2 会议论文
International Conference on Heterogeneous Material Mechanics (ICHMM), Huangshan, PEOPLES R CHINA, JUN 03-08, 2008
作者:  Tang QH(汤奇恒);  Cui LP(崔莉萍);  Tang QH
Adobe PDF(380Kb)  |  收藏  |  浏览/下载：567/91  |  提交时间：2009/07/23
Molecular Dynamics  Sio2  Griffith Fracture Criterion  Brittle Fracture  Silica  
Size-dependent elastic properties of Ni nanofilms by molecular dynamics simulation 会议论文
Asia-Pacific Conference on Surface Science and Engineering, Hong Kong, PEOPLES R CHINA, DEC 19-21, 2006
作者:  Yang ZY(杨振宇);  Zhao YP(赵亚溥);  Zhao YP
Adobe PDF(246Kb)  |  收藏  |  浏览/下载：676/144  |  提交时间：2009/07/23
Molecular Dynamics Simulation  Size-dependent Elastic Properties  Nanofilms  Surface Relaxation  Young's Modulus  Yield Stress  Thin-films  Surface  Stress  Modulus  Metals  Au  Cu  
Molecular dynamics simulation of adhesion forces in a dipalmitoylphosphatidylcholine membrane 会议论文
Asia-Pacific Conference on Surface Science and Engineering, Hong Kong, PEOPLES R CHINA, DEC 19-21, 2006
作者:  Yin J(尹俊);  Zhao YP(赵亚溥);  Zhao YP
Adobe PDF(607Kb)  |  收藏  |  浏览/下载：542/143  |  提交时间：2009/07/23
Dipalmitoylphosphatidylcholine (Dppc)  Molecular Dynamics  Adhesion Forces  Brownian Dynamics  Temperature  Bilayer