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A Quantitative Representation of Damage and Failure Response of Three-Dimensional Textile SiC/SiC Ceramics Matrix Composites Subjected to Flexural Loading 期刊论文
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 2023, 卷号: 145, 期号: 3, 页码: 31001
作者:  Yang ZM(杨正茂);  Pang, Keji;  Lei XQ(雷现奇);  Hu, Qing
Adobe PDF(1147Kb)  |  收藏  |  浏览/下载：78/2  |  提交时间：2023/06/15
ceramic matrix composites  silicon carbide  mechanical behavior  microstructure deformation  damage modeling/model  flexural loading  
Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics 期刊论文
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2022, 卷号: 304, 页码: 14
作者:  Hu, Zhongwei;  Chen, Yue;  Lai, Zhiyuan;  Yu, Yiqing;  Xu, Xipeng;  Peng Q(彭庆);  Zhang, Long
Adobe PDF(16353Kb)  |  收藏  |  浏览/下载：150/29  |  提交时间：2022/08/10
Single-crystal silicon carbide  Vibration-assisted scratch  Double abrasive grains  Molecular dynamics  
Simulations of dislocation density in silicon carbide crystals grown by the PVT-method 期刊论文
JOURNAL OF CRYSTAL GROWTH, 2020, 卷号: 531, 页码: 6
作者:  Chen QS(陈启生);  Zhu P(朱鹏);  He M(何蒙)
Adobe PDF(963Kb)  |  收藏  |  浏览/下载：411/92  |  提交时间：2020/03/11
Computer simulation  Defects  Heat transfer  Stresses  Growth from vapor  Semiconducting silicon compounds  
An in situ system for simultaneous stress measurement and optical observation of silicon thin film electrodes 期刊论文
JOURNAL OF POWER SOURCES, 2019, 卷号: 444, 页码: 5
作者:  Chen J;  Yang L;  Han Y;  Bao YH;  Zhang KL;  Li X;  Pang J;  Chen HS;  Song WL;  Wei YJ(魏宇杰);  Fang DN
浏览  |  Adobe PDF(774Kb)  |  收藏  |  浏览/下载：435/148  |  提交时间：2020/03/11
Lithium ion batteries  Silicon film  Multi-beam optical sensor (MOS)  in situ stress measurement  Colorimetric method  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
浏览  |  Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：307/177  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis