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Static and dynamic wetting of soft substrates 期刊论文
CURRENT OPINION IN COLLOID & INTERFACE SCIENCE, 2018, 卷号: 36, 页码: 46-57
作者:  Chen LQ;  Bonaccurso E;  Gambaryan-Roisman T;  Starov V;  Koursari N;  Zhao YP(赵亚溥)
浏览  |  Adobe PDF(1765Kb)  |  收藏  |  浏览/下载：684/431  |  提交时间：2018/10/30
Capillary force  Disjoining pressure  Elastocapillary length  Substrate deformation  Contact angle  Contact angle hysteresis  Dynamic wetting  Capillary phenomena  
Contact angle hysteresis at the nanoscale: a molecular dynamics simulation study 期刊论文
COLLOID AND POLYMER SCIENCE, 2013, 卷号: 291, 期号: 2, 页码: 307-315
作者:  Wang FC(王奉超);  Zhao YP(赵亚溥);  Zhao, YP (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：1050/351  |  提交时间：2013/03/07
Contact Angle Hysteresis  Critical Shear Stress  Moving Contact Line  Disjoining Pressure  Flexible Substrate  Molecular Dynamics Simulation  
Tap dance of a water droplet 期刊论文
PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 2012, 卷号: 468, 期号: 2145, 页码: 2485-2495
作者:  Wang ZQ(王子千);  Wang FC(王奉超);  Zhao YP(赵亚溥);  Zhao, YP;  Chinese Acad Sci, State Key Lab Nonlinear Mech LNM, Inst Mech, Beijing 100190, Peoples R China.
Adobe PDF(906Kb)  |  收藏  |  浏览/下载：1031/277  |  提交时间：2013/01/18
Electro-elasto-capillarity  Elasto-capillarity  Frequency Doubling  Electrowetting On a Moving Substrate  Superhydrophobic Surfaces  Zno Nanoparticles  Bouncing Behavior  Dynamics  Equilibrium  Fabrication  
Electro-elasto-capillarity:electric field driven unwrapping of water drop with elastic film 会议论文
23rd International Congress of Theoretical and Applied Mechanics, 中国北京/Beijing, China, 2012-08-19
作者:  Zhao YP(赵亚溥);  Wang ZQ(王志乔);  Wang FC(王奉超)
浏览  |  Adobe PDF(164Kb)  |  收藏  |  浏览/下载：376/92  |  提交时间：2014/04/02
Capillarity  Driven  Unwrapping  Water  Field  Electric  Elasto  Elastic  Moving  Substrate  Progress  Agreement  Tension  Doubling  Release  Finding  Voltage  Established  Force  Describe  
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
作者:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
Adobe PDF(691Kb)  |  收藏  |  浏览/下载：333/81  |  提交时间：2014/02/14
Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation