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中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
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力学所知识产出(19... [4]
State Key ... [1]
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魏悦广 [5]
reprint au... [3]
赵海峰 [3]
Chen SH [1]
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Yin HB [1]
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Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate
期刊论文
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2018, 卷号: 85, 期号: 9, 页码: Ar-91004
Authors:
Yin HB
;
Chen SH
;
Liang LH(梁立红)
;
Peng ZL(彭志龙)
;
Wei YG(魏悦广)
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Submit date:2018/12/12
film-substrate system
interface behavior
peeling force
cohesive zone model
L-J potential
Inverse Analysis Determining Interfacial Properties Between Metal Film And Ceramic Substrate With An Adhesive Layer
期刊论文
Acta Mechanica Sinica, 2008, 卷号: 24, 期号: 3, 页码: 297-303
Authors:
Zhao HF(赵海峰)
;
Wei YG(魏悦广)
;
Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech LNM, Beijing 100080, Peoples R China.
Adobe PDF(648Kb)
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Submit date:2009/08/03
Thin Film
Peel Test
Interface Toughness
Cohesive Zonemodel
Inverse Analysis
Peel Test
Cu/cr/polyimide System
Fracture Energy
Thin-films
Strength
Joints
Simulations
Plasticity
Surface
Model
Determination Ofinterfacial Mechanical Parameters For An Al/Epoxy/Al2O3 System Byusing Peel Test Simulations
期刊论文
Acta Mechanica Solida Sinica, 2008, 页码: 198-206
Authors:
You XM(尤雪梅)
;
Zhao HF(赵海峰)
;
Wei YG(魏悦广)
;
Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
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Submit date:2009/08/03
Peel Test
Interface Toughness
Cohesive Zone Model
Energy Release Rate
Ductile Thin-films
Cu/cr/polyimide System
Adhesive Joints
Fracture Energy
Ceramic Substrate
Metal-film
Strength
Layer
Plasticity
Surface
Determination of interface properties between micron-thick metal film and ceramic substrate using peel test
期刊论文
International Journal of Fracture, 2007, 卷号: 144, 期号: 2, 页码: 103-112
Authors:
Zhao HF(赵海峰)
;
Wei YG(魏悦广)
;
Zhao, HF (reprint author), Chinese Acad Sci, State Key Lab Nonlinear Mech LNM, Inst Mech, Beijing 100080, Peoples R China.
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Submit date:2009/08/03
Interfacial Toughness
Metal Thin Film
Peel Test
Cohesive Zone Model
Inverse Analysis
Strain Gradient Plasticity
State Crack-growth
Cu/cr/polyimide System
Adhesive Joints
Fracture Energy
Strength
Layer
Work
Simulations
Surface
Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems
会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
Authors:
Wei YG(魏悦广)
;
Zhao HF
;
Shu SQ
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View/Download:96/19
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Submit date:2017/06/01
Cohesive Zones
Copper Thin Film
Different Scale
Elastic-plastic
Fe Analysis
Interfacial Fracture
Material Parameter
Multi Scale Analysis
Prediction And Analysis
Size Effects
Substrate System
Thin Film Delamination