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用改进的混合方法分析微电子封装热应变场 期刊论文
力学学报, 2002, 卷号: 34, 期号: 4, 页码: 535-540
Authors:  汪海英;  白以龙;  王建军;  邹大庆;  刘 胜
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云纹干涉法  整体/局部方法  改进的混合法  应变分布  
Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method 期刊论文
力学学报, 2002, 卷号: 34, 期号: 3, 页码: 535-540
Authors:  Wang HY(汪海英);  Bai YL(白以龙);  Wang JJ(王建军)
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Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
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Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation