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Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
浏览  |  Adobe PDF(5717Kb)  |  收藏  |  浏览/下载：309/178  |  提交时间：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
A General Strategy for Stretchable Microwave Antenna Systems using Serpentine Mesh Layouts 期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2017, 卷号: 27, 期号: 46
作者:  Chang T;  Tanabe Y;  Wojcik CC;  Barksdale AC;  Doshay S;  Dong ZY;  Liu H;  Zhang MY;  Chen YL;  Su YW(苏业旺);  Lee TH;  Ho JS;  Fan JA;  Fan, JA (reprint author), Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA.
浏览  |  Adobe PDF(2893Kb)  |  收藏  |  浏览/下载：442/154  |  提交时间：2017/12/27
Antennas  Microwaves  Serpentine Meshs  Stretchable Electronics  
Strain-Limiting Substrates Based on Nonbuckling, Prestrain-Free Mechanics for Robust Stretchable Electronics 期刊论文
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2017, 卷号: 84, 期号: 12, 页码: 121010
作者:  Zhang MY;  Liu H;  Cao P;  Chen B;  Hu JQ(胡剑桥);  Chen YL;  Pan B;  Fan JA;  Li R;  Zhang LJ;  Su YW(苏业旺)
浏览  |  Adobe PDF(4302Kb)  |  收藏  |  浏览/下载：359/101  |  提交时间：2017/12/18
Strain-limiting Substrates  Nonbuckling  Prestrain-free Design  Stretchable Electronics  
The main factor influencing the tensile properties of surface nano-crystallized graded materials 期刊论文
Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 26, 页码: 7040-7044
作者:  Li JJ(李建军);  Chen SH(陈少华);  Wu XL(武晓雷);  Soh A;  Lu JA;  Chen SH
Adobe PDF(510Kb)  |  收藏  |  浏览/下载：873/251  |  提交时间：2011/03/01
Surface Nano-crystallized Graded Material  Residual Stress  Work Hardening  Finite Element Method  Mechanical Attrition Treatment  Severe Plastic-deformation  Kelvin Probing Technique  Stainless-steel  Nanocrystalline Surface  Fatigue Resistance  Residual-stresses  Ultrafine Grain  Yield Strain  Nickel-alloy  
Quartz crystal microbalance study of the kinetics of surface initiated polymerization 期刊论文
Science in China Series B-Chemistry, 2009, 卷号: 52, 期号: 12, 页码: 2307-2322
作者:  Chen XA;  Zhang YZ;  He JA;  Xiong CY;  Meng YH(孟永宏);  Jin G(靳刚);  Ma HW
Adobe PDF(955Kb)  |  收藏  |  浏览/下载：868/224  |  提交时间：2011/03/01
Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer 期刊论文
Thin Solid Films, 2004, 卷号: 460, 期号: 1, 页码: 175-180
作者:  Zhou Y;  Yang CS;  Chen JA;  Ding GF,;  Ding W;  Wang L;  Wang MJ;  Zhang YM;  张泰华
Adobe PDF(269Kb)  |  收藏  |  浏览/下载：1989/933  |  提交时间：2007/06/15
Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer 期刊论文
Acta Metallurgica Sinica(English Letters), 2004, 卷号: 17, 期号: 3, 页码: 247-254
作者:  Zhou Y;  Yang CS;  Chen JA;  Ding GF;  Wang L;  Wang MJ;  Zhang YM;  Zhang TH(张泰华)
浏览  |  Adobe PDF(475Kb)  |  收藏  |  浏览/下载：172/44  |  提交时间：2015/09/14
Nickel Film Microbridge  Mems  Mechanical Property  Loadeflection Measurement