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Strain distribution and lattice rotations during in-situ tension of aluminum with a transmodal grain structure 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 828, 页码: 11
作者:  Gao, W. Q.;  Zhang, C. L.;  杨沐鑫.;  Zhang, S. Q.;  Jensen, D. Juul;  Godfrey, A.
Adobe PDF(8128Kb)  |  收藏  |  浏览/下载:250/70  |  提交时间:2021/11/01
Heterogenous grain structure  Strain distribution  High-resolution digital image correlation (HR-DIC)  Near-micrometer grain size  Electron backscatter diffraction (EBSD)  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
浏览  |  Adobe PDF(5717Kb)  |  收藏  |  浏览/下载:310/179  |  提交时间:2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
An experimental study of deformation mechanism and microstructure evolution during hot deformation of Ti-6Al-2Zr-1Mo-1V alloy 期刊论文
MATERIALS & DESIGN, 2013, 卷号: 46, 页码: 38-48
作者:  He D(何东);  Zhu JC;  Lai ZH;  Liu Y;  Yang XW;  Zhu, JC (reprint author), Harbin Inst Technol, Natl Key Lab Precis Hot Proc Met, Harbin 150001, Peoples R China.
Adobe PDF(5650Kb)  |  收藏  |  浏览/下载:1025/363  |  提交时间:2013/03/25
Deformation Mechanism  Recrystallization Mechanism  Microstructure Globularization  Electron Backscatter Diffraction  Titanium Alloys