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Stress evolution in elastic-plastic electrodes during electrochemical processes: A numerical method and its applications 期刊论文
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2018, 卷号: 116, 页码: 403-415
作者:  Wen JC(温济慈);  Wei YJ(魏宇杰);  Cheng YT(郑仰泽)
浏览  |  Adobe PDF(2242Kb)  |  收藏  |  浏览/下载：545/143  |  提交时间：2018/10/30
Battery mechanics  Electrochemical-mechanical coupling  Interfacial delamination  In situ stress measurement  Finite element method  
On The Thermally Induced Interfacial Delamination Of A Segmented Coating 期刊论文
Surface & Coatings Technology, 2008, 页码: 2878-2884
作者:  Chen XJ(陈学军);  Chen GN(陈光南);  Zhang K(张坤);  Luo GX(罗耕星);  Xiao JH(肖京华);  Chen, XJ (reprint author), Univ Sci & Technol Beijing, Sch Appl Sci, 30 Xueyuan Rd, Beijing 100083, Peoples R China.
Adobe PDF(1200Kb)  |  收藏  |  浏览/下载：947/204  |  提交时间：2009/08/03
Interfacial Delamination  Thermal Loading  Segmentation Crack  Dimensional Analysis  Finite Element Method  Barrier Coatings  Cracks  Fracture  System  Films  
Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
作者:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
浏览  |  Adobe PDF(165Kb)  |  收藏  |  浏览/下载：100/21  |  提交时间：2017/06/01
Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination