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Microstructure and mechanical behaviour of a SiC particles reinforced Al-5Cu composite under dynamic loading 期刊论文
Journal of Materials Processing Technology, 1999, 卷号: 94, 期号: 2-3, 页码: 175-178
Authors:  Lu YX;  Meng XM;  Lee CS;  Li RKY;  Huang CG(黄晨光);  Lai JKL;  Lee, CS (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Tat Chee Ave, Kowloon, Hong Kong.
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Thermal-mechanical interface crack behaviour of a surface mount solder joint 期刊论文
Finite Elements in Analysis and Design, 1998, 卷号: 30, 期号: 1-2, 页码: 19-30
Authors:  Wu CML;  Lai JKL;  Wu YL(吴永礼);  Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China.
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Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package 期刊论文
COMPOSITE STRUCTURES, 1997, 卷号: 38, 期号: 1-4, 页码: 525-530
Authors:  Wu CML;  Lai JKL;  Wu YL(吴永礼);  Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong.
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