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A nanotwin-based analytical model to predict dynamics in cryogenic orthogonal machining copper 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2020, 卷号: 111, 期号: 11-12, 页码: 3189-3205
作者:  Liu Y(刘垚);  Cai SL(蔡松林);  Chen Y(陈艳);  Su MY(苏明耀);  Dai LH(戴兰宏)
Adobe PDF(11473Kb)  |  收藏  |  浏览/下载：457/56  |  提交时间：2020/12/28
Machining  METAL-CUTTING PROCESS  Orthogonal cutting model  SURFACE INTEGRITY  Cryogenic cooling  FLOW-STRESS  Hopf bifurcation  RATE SENSITIVITY  Nanotwin  INCONEL 718  GRAIN-SIZE  STRENGTH  MICROSTRUCTURE  DEFORMATION  SPEED  
Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations 期刊论文
ACTA MATERIALIA, 2016, 卷号: 108, 页码: 252-263
作者:  Yang XS;  Wang YJ(王云江);  Wang GY;  Zhai HR;  Dai LH(戴兰宏);  Zhang TY;  Zhang, TY (reprint author), Shanghai Univ, Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
浏览  |  Adobe PDF(4249Kb)  |  收藏  |  浏览/下载：284/115  |  提交时间：2016/09/14
Stress Relaxation  Nanotwin  Copper  Hrtem  Atomistic Simulations  
Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations 期刊论文
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2016, 卷号: 94, 页码: 191-206
作者:  Yang XS;  Wang YJ(王云江);  Zhai HR;  Wang GY;  Su YJ;  Dai LH(戴兰宏);  Ogata S;  Zhang TY;  Zhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
浏览  |  Adobe PDF(4683Kb)  |  收藏  |  浏览/下载：449/130  |  提交时间：2016/12/08
Creep  Nanotwin  Activation Parameters  Hrtem  Atomistic Simulations