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Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations 期刊论文
ACTA MATERIALIA, 2016, 卷号: 108, 页码: 252-263
作者:  Yang XS;  Wang YJ(王云江);  Wang GY;  Zhai HR;  Dai LH(戴兰宏);  Zhang TY;  Zhang, TY (reprint author), Shanghai Univ, Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
浏览  |  Adobe PDF(4249Kb)  |  收藏  |  浏览/下载：290/118  |  提交时间：2016/09/14
Stress Relaxation  Nanotwin  Copper  Hrtem  Atomistic Simulations  
Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations 期刊论文
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2016, 卷号: 94, 页码: 191-206
作者:  Yang XS;  Wang YJ(王云江);  Zhai HR;  Wang GY;  Su YJ;  Dai LH(戴兰宏);  Ogata S;  Zhang TY;  Zhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
浏览  |  Adobe PDF(4683Kb)  |  收藏  |  浏览/下载：458/132  |  提交时间：2016/12/08
Creep  Nanotwin  Activation Parameters  Hrtem  Atomistic Simulations