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Film residual stress assessment method via temporarily thermal relaxation
Cheng XX(程欣欣); Wu CW(吴臣武); Chen-wu Wu
Source PublicationExperimental and Applied Mechanics
2013
Volume4Pages:267-276
Abstract

The concept of temporarily thermal relaxation is extended theoretically to assess the film residual stress. First, the contribution of the initial stress to the observable displacement field is separated with eliminating the thermal expansion effect of the material. Then, the residual stress is inversely derived through the displacement increment. Finally, finite element analysis was carried out to provide numerical description of the partial relieve of the residual stress.

KeywordFilm Residual Stress Assessment Temporarily Thermal Relaxation
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Indexed ByEI
Language英语
DepartmentMAM表面与界面改性
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/47119
Collection先进制造工艺力学重点实验室
Corresponding AuthorChen-wu Wu
Recommended Citation
GB/T 7714
Cheng XX,Wu CW,Chen-wu Wu. Film residual stress assessment method via temporarily thermal relaxation[J]. Experimental and Applied Mechanics,2013,4:267-276.
APA 程欣欣,吴臣武,&Chen-wu Wu.(2013).Film residual stress assessment method via temporarily thermal relaxation.Experimental and Applied Mechanics,4,267-276.
MLA 程欣欣,et al."Film residual stress assessment method via temporarily thermal relaxation".Experimental and Applied Mechanics 4(2013):267-276.
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