IMECH-IR  > 力学所知识产出(1956-2008)
Temperature distribution over 6-inch mono-crystal silicon substrate heated by parallel molybdenum filaments in vacuum
Li SH(李帅辉); Shu YH(舒勇华); Tang JR(唐锦荣); Fan J(樊菁); Li, SH (reprint author), Chinese Acad Sci, Inst Mech, Key Lab High Temp Gas Dynam, Beijing 100080, Peoples R China.
会议录名称Vacuum Metallurgy and Surface Engineering, Proceedings/真空冶金与表面工程——第八届真空冶金与表面工程学术会议论文集
2007
会议名称8th Vacuum Metallurgy and Surface Engineering Conference
会议日期JUN 16-19, 2007
会议地点Shenyang, PEOPLES R CHINA
摘要Uniform temperature distribution over a substrate is one of the important issues in the vapor deposition of large - area films. We employ both numerical and experimental approaches to study the temperature distribution over a 6 - inch monocrystal silicon substrate radiated by a molybdenum filament heater in our PVD facility. An infrared colorimetric measurement shows that the mean temperature of the substrate is 1093 K under an electric power of 3860 W, and the maximum temperature difference between the center, and circumference is about 6 K. The calculated temperature distributions agree well with the experimental data, and further computational analysis shows that the shielding effect of the molybdenum filaments on radiation, the number of thermal insulation plates around the heater, and the thermal conduction of the heater walls and substrate all affect significantly the substrate temperature distribution. It is therefore needed to consider them in the design of high performance substrate heaters.
WOS记录号WOS:000248081800042
ISBN号978-7-121-04043-6
收录类别CPCI-S
语种英语
引用统计
文献类型会议论文
条目标识符http://dspace.imech.ac.cn/handle/311007/58897
专题力学所知识产出(1956-2008)
通讯作者Li, SH (reprint author), Chinese Acad Sci, Inst Mech, Key Lab High Temp Gas Dynam, Beijing 100080, Peoples R China.
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Li SH,Shu YH,Tang JR,et al. Temperature distribution over 6-inch mono-crystal silicon substrate heated by parallel molybdenum filaments in vacuum[C]Vacuum Metallurgy and Surface Engineering, Proceedings/真空冶金与表面工程——第八届真空冶金与表面工程学术会议论文集,2007.
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