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Acoustic valley edge states in a graphene-like system with sub-wavelength resonator
Jiang H(姜恒); Chen M(陈猛); Wang YR(王育人)
会议录名称Proceedings of the 26th International Congress on Sound and Vibration, ICSV 2019
2019
会议名称26th International Congress on Sound and Vibration, ICSV 2019
会议日期July 7, 2019 - July 11, 2019
会议地点Montreal, QC, Canada
摘要

Recently, the study of topological phase transitions and edge states for acoustic wave systems has become a research hotspot. However, most current studies on topological edge states are based on Bragg scattering, which is not practical to apply in situations involving low-frequency sound because of the large structural dimensions. Therefore, we construct in this study a graphene-like structure based on a sub-wavelength resonant unit Helmholtz resonator and adjust the acoustic capacitance diameter of adjacent units to change the local resonance frequency, and thereby impose the degeneracy of the Dirac cone and topological spin states, which is characterized by valley Chern numbers of opposite sign. We also check topological valley edge states at zigzag and armchair interfaces and find that gapless topological valley edge states only appear at zigzag interfaces, whereas armchair interfaces host gap edge states. Moreover, the results show that the transmission properties of edge states in a zigzag rectangular waveguide are immune to backscattering and defects © Proceedings of the 26th International Congress on Sound and Vibration, ICSV 2019. All rights reserved.

关键词Acoustic metamaterials Dirac cones Edge state Graphene likes Helmholtz resonators Structural dimensions Sub wavelength resonators Transmission property
ISBN号9781999181000
收录类别EI
语种英语
文献类型会议论文
条目标识符http://dspace.imech.ac.cn/handle/311007/80472
专题微重力重点实验室
作者单位Key Laboratory of Microgravity, Institute of Mechanics, Chinese Academy of Sciences, Beijing, China
推荐引用方式
GB/T 7714
Jiang H,Chen M,Wang YR. Acoustic valley edge states in a graphene-like system with sub-wavelength resonator[C]Proceedings of the 26th International Congress on Sound and Vibration, ICSV 2019,2019.
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