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Enhanced tensile properties by heterogeneous grain structures and coherent precipitates in a CoCrNi-based medium entropy alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 832, 页码: 11
Authors:  Zhang ZH(张子晗);  Jiang P(姜萍);  Yuan FP(袁福平);  Wu XL(武晓雷)
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High entropy alloys  Heterogeneous structures  Precipitates  Strain hardening  Strengthening  Ductility  
Microstructure evolution and fracture mechanism of a TiAl-Nb alloy during high-temperature tensile testing 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 831, 页码: 12
Authors:  Zhang, Shunke;  Tian, Ning;  Li, Deyuan;  Li JH(李江华);  Jin, Fangwei;  Wang, Guangyan;  Tian, Sugui
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TiAl-Nb alloy  Microstructure  Deformation mechanism  Damage features  
Strain distribution and lattice rotations during in-situ tension of aluminum with a transmodal grain structure 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 828, 页码: 11
Authors:  Gao, W. Q.;  Zhang, C. L.;  杨沐鑫.;  Zhang, S. Q.;  Jensen, D. Juul;  Godfrey, A.
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Heterogenous grain structure  Strain distribution  High-resolution digital image correlation (HR-DIC)  Near-micrometer grain size  Electron backscatter diffraction (EBSD)  
Deformation mechanisms of basal slip, twinning and non-basal slips in Mg-Y alloy by micropillar compression 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 819, 页码: 9
Authors:  Li N(李娜);  Yang, Lingwei;  Wang, Chuanyun;  Monclus, M. A.;  Shi, Dongfeng;  Molina-Aldareguia, J. M.
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Magnesium alloy  Mechanical property  Micropillar compression  Deformation mechanisms  
The mechanism of internal fatigue-crack initiation and early growth in a titanium alloy with lamellar and equiaxed microstructure 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 798, 页码: 140110
Authors:  Pan XN(潘向南);  Xu SW(徐守文);  Qian GA(钱桂安);  Alexander N;  Andrey S;  Thierry PL;  Hong YS(洪友士)
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Exceptional tensile properties under cryogenic temperature in heterogeneous laminates induced by non-uniform martensite transformation and strain delocalization 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 791, 页码: 10
Authors:  He JY(何金燕);  Yuan FP(袁福平);  Yang MX(杨沐鑫);  Zhou LL(周玲玲);  Jiao SH;  Wu XL(武晓雷)
Adobe PDF(3946Kb)  |  Favorite  |  View/Download:269/95  |  Submit date:2020/08/26
Twins  Heterogeneous laminates  Cryogenic tensile properties  Martensite transformation  Strain delocalization  
Tuning heterostructures with powder metallurgy for high synergistic strengthening and hetero-deformation induced hardening 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 777, 页码: 5
Authors:  Li ZK;  Fang X T;  Wang Y F;  Jiang P;  Wang J J;  Liu C M;  Wu XL(武晓雷);  Zhu Y T;  Koch C C
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Heterogeneous lamella structure  Synergistic strengthening  Hetero-deformation induced hardening  Powder metallurgy  
One-step annealing optimizes strength-ductility tradeoff in pearlitic steel wires 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 757, 页码: 1-13
Authors:  Xiang L(向亮);  Liang LW(梁伦伟);  Wang YJ(王云江);  Chen Y(陈艳);  Wang HY(汪海英);  Dai LH(戴兰宏)
View  |  Adobe PDF(3415Kb)  |  Favorite  |  View/Download:477/171  |  Submit date:2019/09/09
Pearlitic steel wire  Carbon state  Annealing  Strength and ductility  Atomistic simulations  
Superior mechanical properties and deformation mechanisms of heterogeneous laminates under dynamic shear loading 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 756, 页码: 492-501
Authors:  He JY(何金燕);  Yuan FP(袁福平);  Yang MX(杨沐鑫);  Jiao SH(焦四海);  Wu XL(武晓雷)
View  |  Adobe PDF(1558Kb)  |  Favorite  |  View/Download:420/94  |  Submit date:2019/09/09
Laminates  Twinning  Strain gradient  Geometrically necessary dislocations  Dynamic fracture  Shear band  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download:336/186  |  Submit date:2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis