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Experimental study of the influence of thermal shock on mechanical properties of ceramic coating systems 会议论文
13th International Conference on Fracture 2013, ICF 2013, Beijing, China, June 16, 2013 - June 21, 2013
Authors:  Li XN(李霄娜);  Liang LH(粱立红);  Wei H;  Wei YG(魏悦广)
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Bending strength  Bending tests  Ceramic coatings  Ceramic materials  Elastic moduli  Fracture  Hardness  Mechanical properties  Microstructure  Thermal shock  Air plasma sprayed  Change of temperatures  Coating  substrate systems  Nanoindentation tests  Nanostructured coatings  Shock temperature  Temperature range  Three  point bending test  
Shallow and deep nanoindentation on W/NbN nanolayers 会议论文
IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials, Beijing, China, June 27, 2005 - June 30, 2005
Authors:  Mao SX;  Ennis BM;  Wei YG(魏悦广)
View  |  Adobe PDF(159Kb)  |  Favorite  |  View/Download:174/72  |  Submit date:2017/06/01
Alternating Layers  Bi-layer  Bilayer Period  Body-centered Cubic  Face-centered Cubic  Indentation Depth  Metal Layer  Mgo Single Crystals  Nano Layers  Niobium Nitride  Rule Of Mixture  Superhardening  
Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate 会议论文
IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials, Beijing, PEOPLES R CHINA, JUN 27-30, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ;  Wei, YG (reprint author), Chinese Acad Sci, LNM, Inst Mech, Beijing 100080, Peoples R China.
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Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
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Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination  
Solutions and discussions of thin film undergoing the nonlinear peeling 会议论文
Symposium on Thin Films - Stresses and Mechanical Properties X held at the 2003 MRS Fall Meeting, Boston, MA, DEC 01-05, 2003
Authors:  Wei YG(魏悦广);  Shu SQ;  Du Y;  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
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