Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems

IMECH-IR > 力学所知识产出(1956-2008)

	Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems
	Wei YG(魏悦广); Zhao HF; Shu SQ
会议录名称	11th International Conference on Fracture 2005, ICF11
	2005
会议名称	11th International Conference on Fracture 2005, ICF11
会议日期	March 20, 2005 - March 25, 2005
会议地点	Turin, Italy
摘要	In this paper, both the cohesive zone/nonlinear bending model and the cohesive zone/plane strain elastic-plastic FE analysis model are adopted for analyzing the thin film nonlinear peeling process. Characteristics of the energy release rate are analyzed and presented. The analysis results based on both models are used to predict peeling experiment of copper thin film on the ceramic interface. Through prediction and analyses, one found that for the same experimental result, the effective simulations can be obtained based on both models, however, different material parameters are corresponded. It implies that two models are suitable for different scales. Combining the results based on both models, size effects of thin film delamination are characterized.
关键词	Cohesive Zones Copper Thin Film Different Scale Elastic-plastic Fe Analysis Interfacial Fracture Material Parameter Multi Scale Analysis Prediction And Analysis Size Effects Substrate System Thin Film Delamination
收录类别	EI
语种	英语
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/60282
专题	力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Wei YG,Zhao HF,Shu SQ. Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems[C]11th International Conference on Fracture 2005, ICF11,2005.

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