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Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
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Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination  
Size, Geometry and Nonuniformity Effects of Surface-Nanocrystalline Aluminum in Nanoindentation Test 期刊论文
International Journal of Plasticity, 2005, 卷号: 21, 期号: 11, 页码: 2089-2106
Authors:  Wei YG(魏悦广);  Shu SQ(舒思齐);  Du Y(杜莹);  Zhu C(朱晨);  Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Adobe PDF(595Kb)  |  Favorite  |  View/Download：680/239  |  Submit date：2007/06/15