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Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2019, 卷号: 161, 页码: 9
Authors:  Long X;  Hu B;  Feng YH(冯义辉);  Chang C;  Li MY
View  |  Adobe PDF(3448Kb)  |  Favorite  |  View/Download：324/166  |  Submit date：2020/03/11
Silver nanoparticles  Silver microparticles  Nanoindentation  Microstructure  Constitutive behaviour  
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
View  |  Adobe PDF(5717Kb)  |  Favorite  |  View/Download：324/182  |  Submit date：2019/11/27
Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
Three-Dimensional Numerical Simulation on Marangoni Convection in a Sessile Water Droplet Evaporating in its Vapor at Low Pressure 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2019, 卷号: 31, 期号: 2, 页码: 231-240
Authors:  Zhang Y;  Li YR;  Yu JJ;  Liu QS(刘秋生)
View  |  Adobe PDF(1921Kb)  |  Favorite  |  View/Download：320/142  |  Submit date：2019/06/10
Sessile droplet  Evaporation  Marangoni convection  Kinetic model  Numerical simulation